(Beijing Comprehensive News) Chinese communications equipment company Huawei has applied for a “quad-chiplet” packaging patent, which may be used in the next generation of artificial intelligence chips in the future, becoming the key to circumventing the US technology blockade.
According to reports from the United Daily News and China Times News Network, Huawei recently submitted an application to the State Intellectual Property Office of China for a “quad-chiplet” packaging patent, which is very similar to Nvidia’s Rubin Ultra and is very likely to be used in Huawei’s next-generation artificial intelligence chip Ascend 910D.
The report said that although “Ascend 910D” was not directly mentioned, the processor design described in Huawei’s patent information is consistent with industry rumors. According to the information, the performance of the quad-chip AI accelerator developed using this technology is expected to exceed Nvidia’s H100.